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3D-Micromac shows novel laser processing solutions at Semicon West 2014

For the first time 3D-Micromac AG will present its microDICE™ laser dicing system and further innovative solutions for processing of semiconductors at Semicon West 2014 San Francisco, CA. – July 7, 2014 3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, will present novel laser applications for semiconductor industry at Semicon West 2014 in […]

3D-Micromac AG acquires TLS-Dicing from Jenoptik

Chemnitz, Jan 16, 2014 – Jenoptik and 3D-Micromac AG announce the technology transfer of thermal laser separation (TLS-Dicing®) as part of a so-called asset deal. As of January 1, 2014, know-how, patents and results of the development from Jenoptik’s Laser & Materials Processing Division are transferred to 3D-Micromac AG in Chemnitz.