2016

CS Compound Semiconductor

3D-Micromac: a faster slice

Hans-Ulrich Zuehlke

Chip Scale Review November/December 2016; Volume 20, Number 6

Dicing silicon carbide power devices using thermal laser separation

Hans-Ulrich Zuehlke, Mandy Gebhardt

TAP TIMES, November 2016, No. 11, Vol. 7

A new wafer-dicing approach for silicon carbide devices

Hans-Ulrich Zuehlke, Mandy Gebhardt

2015

SNEC Conference 2015

PV Cell separation by Thermal Laser Separation

Hans-Ulrich Zuehlke1),Thomas Kiessling1), Kai Kaufmann2), Norbert Bernhard2,3), Marko Turek3), Felix Kaule3), Stephan Schoenfelder3), Joerg Bagdahn2,3), Dirk Lewke4) 1) 3D-Micromac AG, 2) Anhalt University of Applied Sciences, 3) Fraunhofer Center for Silicon Photovoltaics CSP, 4) Fraunhofer Institute for Integrated Systems and Device Technology IISB

Materials Science Forum

Thermal Laser Separation – A Novel Dicing Technology Fulfilling the Demands of Volume Manufacturing of 4H-SiC Devices.

Lewke, Dirk; Dohnke, Karl Otto; Zühlke, Hans Ulrich; Cerezuela Barret, Mercedes; Schellenberger, Martin; Bauer, Anton; Ryssel, Heiner

In: Materials Science Forum 821-823, S. 528–532.

2014

MRS Spring Meeting 2014

High Quality and high Speed cutting of 4H-SiC JFET Wafers including PCM structures by using thermal laser Separation

Dirk Lewke, Matthias Koitzsch, Martin Schellenberger, Lothar Pfitzner, Heiner Ryssel, Fraunhofer Institute for Integrated Systems and Device Technology (IISB)

In: Proceedings of 2014 MRS Spring Meeting.

2013

ASMC 2013

Improving electric behavior and simplifying production of Si-based diodes by using thermal laser separation

Koitzsch, M. et al.

In: Proceedings of ASMC 2013.

2012

Future Fab 2012, Issue 42

Thermal Laser Separation and Its Applications

Dirk Lewke, Matthias Koitzsch, Martin Schellenberger, Lothar Pfitzner, Heiner Ryssel, Fraunhofer Institute for Integrated Systems and Device Technology (IISB)
Hans-Ulrich Zühlke, Jenoptik Automatisierungstechnik GmbH


MRS Spring Meeting 2012

Ablation Free Dicing of 4H-SiC Wafers with Feed Rates up to 200 mm/s by Using Thermal Laser Separation

Lewke, D., M. Koitzsch, M. Schellenberger, L. Pfitzner, H. Ryssel, H.-U. Zühlke

In: Proceedings of MRS Spring Meeting, Symposium: Silicon Carbide Materials, Processing and Devices, 2012

ISCDG 2012

Advanced Vacuum Wafer Dicing for Thermal Laser Separation

O. Le-Barillec, M. Davenet, A. Favre, B. Bellet, adixen Vacuum Products, Annecy, France

M. Koitzsch, D. Lewke, M. Schellenberger, Fraunhofer IISB, Erlangen, Germany

H-U. Zühlke, JENOPTIK, Jena, Germany

 

CSSC6 2012

Thermal Laser Separation – Damage-free and  Kerfless Cutting of Wafers and Solar Cells

Koitzsch, M. et. al.

In: Proceedings of The 6th International workshop on Crystalline Silicon for Solar Cells, October 8-11, 2012, Aix-les-Bains, France

 

ASMC 2012

Enhancements in resizing single crystalline silicon wafers up to 450 mm by using thermal laser separation

M. Koitzsch, D. Lewke, M. Schellenberger, L. Pfitzner, H. Ryssel, H.-U. Zühlke

In: Proceedings of ASMC 2012, Saratoga Springs, 2012.

2009

IMAPS 2009

TLS-Dicing –The Key to higher Yield and Throughput for thin Wafers

Zuehlke, Hans-Ulrich et. al.

In: Proceedings of 42nd International Symposium on Microelectronics. San Jose, California, 2009.

 

ASMC 2009

TLS-Dicing –  an innovative alternative to known technologies

Hans-Ulrich Zühlke, Gabriele Eberhardt, Ronny Ullmann

In: Proceedings of ASMC 2009.

 

2008

ISSM

TLS-Dicing – the way to higher yield and throughput

Zuehlke, Hans-Ulrich; Eberhardt, Gabriele; Mende, Patrick

In: Proceedings of ISSM 2008, Tokyo, 2008